iPhone 8 will be a foldable Apple smartphone, leaks reveal
Facebook post of tech expert Robert Scoble stated about the upcoming ‘All glass iPhone 8’ technology created quite a stir among Apple fans.
Scoble posted in his page that,
The next iPhone will be, I am told, a clear piece of glass (er, Gorilla Glass sandwich with other polycarbonates for being pretty shatter resistant if dropped) with a next-generation OLED screen (I have several sources confirming this). You pop it into a headset which has eye sensors on it, which enables the next iPhone to have a higher apparent frame rate and polygon count than a PC with a Nvidia 1080 card in it. Thanks to foveated rendering.
Next iPhone 8 is said to be integrating all these new technology features to make a totally different and new iPhone to revive interest of the market.
All major news portals covering Apple leaks made a detailed report on these advanced formats and Apple fans are keenly looking into this.
Anyway, with the new patent about ‘Foldable’ iPhone, Apple is said to set new standards as far as expectations of the fans is concerned.
The adapted technology of ‘carbon nanoube structures’ are key components in the making of new iPhone.
‘Carbon nanotube structures may include single-wall carbon nanotubes, multiple-wall carbon nanotubes, or mixtures of single-wall and multiple-wall carbon nanotubes. Carbon nanotubes can form conductive paths for printed circuits or other flexible substrates such as substrates associated with touch sensors and displays and can form structural components in an electronic device.’
Conductive carbon nanotube paths can form signal paths that are flexible and resistant to cracking.
The carbon nanotube structures may be incorporated into signal cables such as flexible printed circuit cables, rigid printed circuit boards, printed circuits that include rigid portions with flexible tails (sometimes referred to as “rigid flex”), portions of display structures, portions of touch sensors such as capacitive touch sensor arrays for displays or track pads, camera structures, antenna structures, housing structures, internal device structures, electrical components, substrates, brackets, housing walls, other structures, or combinations of these structures.’